Data Center Servers – Efficiency Throughout the System


Thermal design power (TDP), the maximum heat from a digital processor that a computer system must dissipate, is a growing issue for Data Centers.

In March 2023, industry sources reported, "Product Roadmaps call for 500 W to 600 W TDP processors in a few years. This will result in mainstream "workhorse" servers approaching or exceeding 1 kW in power consumption each — an escalation that will strain not only cooling but also power delivery within the server chassis."

For Data Centers, the challenge is how to best address the growth of TDP. Industry discussions include raising operating temperatures without compromising equipment reliability, and liquid and immersion cooling.

A direct way to address these challenges is to reduce the amount of heat generated by improving power conversion efficiencies along with compute/watt performance so less heat is generated and less power is required, respectively.

Endura Technologies’ Solution

Endura Technologies’ power delivery architecture is ideal for these applications. Endura Technologies’ modular digital control and use of advanced semiconductor process technology enable industry-leading efficiencies and high-speed switching for smaller footprints. This scalable architecture ranges from standard power management devices (sVR) to embedded (eVR) chiplets down to on-chip, integrated (iVR) blocks for optimum point-of-load energy delivery.

High-speed switching (up to 150 MHz) means Endura Technologies’ eVR and iVR technologies are small enough to be placed very close to where the power is needed, which enables improved system performance.


Improving power conversion efficiency for both light and heavy loads means less wasted power, which directly reduces the heat generated.

With eVR and iVR point-of-load power delivery, compute/watt performance can be optimized which makes the system more efficient, thus reducing the power needed.

In addition, point-of-load delivery also means fewer power rails and routing in the system. Thus, the delivery of energy to the power conversion point is optimized, reducing wasted power in the system, which reduces heat.

These are compounding benefits – improved compute/watt (less power needed) coupled with more efficient power delivery (lower system loss) coupled with more efficient power conversion (reduced conversion loss) – all combine to directly eliminate heat in the system.

Reducing the heat generated is a direct way to address TDP challenges facing Data Centers going forward.

Too hot to handle? Operators to struggle with new chips

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