Application Study: Data Center Memory Enabling Data Center Compute Scalability


The adoption of DDR5 memory modules in servers allows memory capacity to continue to scale in line with every increasing processor power but also drives significant challenges for server design. Increasing memory capacity, increasing interface speeds, and the PMIC moving from the motherboard to the DIMM module all contribute to excess heat dissipation beyond the current cooling capacity of industry-standard servers. Endura Technologies closely partners with leading DRAM suppliers, such as Kingston and Longsys, to design solutions that enable memory capacity to continue to scale without the need for a complete overhaul of a server’s cooling system.
Micron AI memory portfolio
Endura Technologies Solution

Endura Technologies’ power delivery architecture, implemented on the 55nm process node, is JEDEC5100 compliant and a drop-in replacement for the current PMIC solution. This technology’s high-efficiency voltage conversion technology boosts overall efficiency and reduces the amount of wasted power that dissipates into heat. It is highly scalable and maintains its high efficiency over the full spectrum of amp loads.
Endura vs Comp R

Endura Technologies’ high-efficiency voltage conversion technology drives a full 7% increase in overall efficiency relative to current solutions on the market. For the average dual-socket server (32 DIMMs), Endura Technologies’ solution reduces heat dissipation and electricity b consumption by approximately 18 watts. This increase in efficiency results in significant operational cost savings for the data center operator. Just on direct power system power consumption alone, there is an annual electricity cost savings of approximately $20 per server per year.
Excess Heat Dissipation (Watts)

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